Every board that builds right the first time starts with parts built to standard. IPC guidelines define how footprints, paste apertures, thermal vias, and manufacturing data should be built. Neurocad builds those standards into every part it generates, so your designs stay consistent from intent to manufacturing. Learn more.
| Standard | Title | What it covers | Design stage |
|---|---|---|---|
| IPC-7351B | Generic Requirements for Surface Mount Design and Land Pattern Standard | Surface-mount land patterns, density levels, footprint naming (no longer maintained; succeeded by IPC-7352) | Component library |
| IPC-7352 | Generic Guideline for Land Pattern Design | Current land pattern guidance for surface-mount and through-hole components | Component library |
| IPC-7093 | Design and Assembly Process Implementation for Bottom Termination Components | QFN, DFN, SON, and LGA land patterns, thermal pads, thermal vias, and paste | Component library, assembly |
| IPC-7525 | Stencil Design Guidelines | Stencil apertures, thickness, area and aspect ratios for solder-paste printing | Component library, assembly |
| IPC-2221 | Generic Standard on Printed Board Design | Conductor spacing, materials, vias, thermal and electrical design rules | Board layout |
| IPC-2581 | Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology | XML format for complete PCB fabrication and assembly data | Manufacturing handoff |
| IPC-A-610 | Acceptability of Electronic Assemblies | Visual acceptance criteria for finished assemblies, by product class | Inspection |
| IPC Classes 1, 2, 3 | Product classification (used across IPC-A-610, IPC-6012, J-STD-001, and other standards) | Class 1: general electronic products. Class 2: dedicated service products needing extended life. Class 3: high-performance and harsh-environment products where downtime isn't acceptable | Product definition; carried through all stages |